Steffen (IBM) - Social Center. CQ 5 is a high-availability database solution for IBM zSeries that offers a. IBM zSeries (Power Systems) documentation covering z/OS V1.3 and V1.4. 04/09/2000 IBM Release z14.1 002; Lazy Bookworms-Run a ftp server. 08/31/2004The subject matter of the present application relates to microelectronic packages, and more particularly, to a heat spreader using a copper core and having a thermal interface material (TIM).
In a typical packaging technology, a semiconductor chip (or die) is bonded to a package substrate, such as an interposer, a build-up core board, a mother board, a ceramic board, or a carrier substrate, for example. The semiconductor chip and the package substrate are electrically connected to one another through wirebonding, solder ball bonding, or through the use of conductive adhesives.
Because of the ever increasing demand for smaller, lighter, and faster electronic products, there is ever increasing pressure to reduce the size of the semiconductor package, as well as reduce the overall size of electronic products. Reducing the overall size of the package can reduce the size and the weight of the electronic products. Further, reducing the size and weight of the electronic products can reduce the space taken up by the electronic products and can allow additional functions to be integrated into a single package.
However, as the electronic devices continue to shrink in size and approach the 3-10 watt power range, thermal management becomes a critical area of design. Currently, most thermal management techniques are primarily passive, relying on thermal conduction or convection. Convection techniques are limited by the speed at which heat transfer can be achieved, as well as the height at which the semiconductor package and the heat spreader are placed.
Thus, a need exists for a thermal management scheme that provides high heat transfer rates and low height of the semiconductor package and the heat spreader.1. Field of the Invention
The present invention relates to a test circuit for testing a system on a chip including a plurality of storage elements.
2. Related Art
System on a chip (hereinafter, referred to as “SOC”) refers to a system that includes a single application specific integrated circuit (hereinafter, referred to as “ASIC”) and a memory unit. SOC can reduce development costs 0b46394aab